Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die

ABSTRACT

Provided is a light emitting device wherein a resin molded body having a circular or an oval recessed section at the center suppresses generation of cracks. A light emitting device ( 1 ) is provided with a light emitting element ( 2 ); a first resin molded body ( 10 ) having a plurality of outer surfaces ( 11 ), and a recessed section ( 10   a ) at the center; a first lead ( 20 ) and a second lead ( 30 ) electrically connected to the light emitting element ( 2 ); and a second resin molded body ( 40 ) applied in the recessed section ( 10   a ). The light emitting element ( 2 ) is place on the first lead ( 20 ), and the surface of the second resin molded resin ( 40 ) is permitted to be a light emitting surface. A gate notch ( 50 ) obtained by cutting a gate formed on the outer surface ( 11 ) of the first resin molded body ( 10 ) is formed on an extended line of a normal line on one point on a circular cross-section of the recessed section ( 10   a ) in the normal nine direction.

TECHNICAL FIELD

The present invention relates to a light emitting device to be used for,for example, lighting apparatuses, displays, a backlight of cellularphone, an auxiliary light source for animation illumination, and othergeneral consumer light sources, a package suitable for the lightemitting device, a manufacturing method of the light emitting device, amanufacturing method of the package, and a package manufacturing die.

BACKGROUND ART

Generally, it is well known that a light emitting device using a lightemitting element is compact and excellent in power efficiency and emitsbright colors. The light emitting element used for the light emittingdevice is a semiconductor device. Therefore, the light emitting elementis excellent in an initial drive performance in addition to almost freefrom blowout, and resistant to vibrations and repetitions of ON/OFFswitching. Since the light emitting element has excellentcharacteristics as described above, a light emitting device using thelight emitting element such as a light emitting diode (LED) and a laserdiode (LD) is used for various kinds of light sources.

-   Patent literature 1: Japanese Patent Laid-open Publication No.    2005-259972-   Patent literature 2: Japanese Patent Laid-open Publication No.    2001-177160-   Patent literature 3: Japanese Patent Laid-open Publication No.    H11-45958-   Patent literature 4: Japanese Patent Laid-open Publication No.    2006-156704-   Patent literature 5: Japanese Patent Laid-open Publication No.    2005-294736

Here, FIG. 10 is a side cross sectional view showing a conventionallight emitting device 100 according to the Japanese Patent Laid-openPublication No. 2005-259972 or the Japanese Patent Laid-open PublicationNo. 2001-177160.

The conventional light emitting device 100 shown in FIG. 10 includes alight emitting element 101, a mounting lead frame 102 for mounting thelight emitting element 101, a wiring lead frame 103 to be connected tothe light emitting element 101 through a lead wire, and a resin moldbody 104 covering a most part of each lead frame. The resin mold body104 has, for example, a rectangular outer shape in plan view, and isprovided with a concave portion 105 having a circular truncated coneshape which becomes narrower toward downward at approximately the centerof the resin mold body 104. The mounting lead frame 102 is set on abottom surface of the concave portion 105, and the light emittingelement 101 is placed on an upper surface of the mounting lead frame102. In addition, a resin 108 is disposed in the concave portion 105 asa light emitting portion.

As described above, since the light emitting portion is formed byfilling the resin 108 in the concave portion 105 which is opened upward,a light emitted from the light emitting element 101 is uniformlyreflected by the bottom surface and side surface of the concave portion105. As a result, the light can be output from a light emitting surfaceside, on which the light emitting element 101 is placed, withoutpolarizing.

Generally, the resin mold body 104 of the light emitting device 100described above is integrally formed with the lead frames 102, 103.Here, FIG. 11 is a side cross sectional view showing a molding method ofa conventional resin mold body (see Japanese Patent Laid-openPublication No. H11-45958).

A method for molding the resin mold body 104 is as follows. As shown inFIG. 11, the lead frames 102, 103 are set between an upper die 111 and alower die 112, and a thermoplastic resin is injected and filled into aspace 114 formed by the upper die 111 and the lower die 112 from aninjection port 115. Then, the filled thermoplastic resin is cured toform the resin mold body 104 (hereinafter, this molding method isreferred to as “molding method 1”).

The molding method 1 is characterized in that, by injecting athermoplastic resin from the bottom center of the lower die 112, theresin is radially diffused, and thereby the resin is uniformly filled inevery corner of the space 114. It is noted that a protruding portion 117corresponding to the concave portion 105 is formed in the upper die 111.

However, there have been the following problems in the molding method 1.That is, in the molding method 1, since the injection port 115 isdisposed at the bottom center of the resin mold body 104, a gate remain106 is formed at the bottom center of the resin mold body 104 as shownin FIG. 10. The gate remain is a protrusion remaining on a resin moldbody when the dies are opened and the resin mold body (gate), which isformed at the injection port portion when a thermoplastic resin isinjected from the injection port, is cut off from the gate portion. Ifthe gate remain 106 is formed at the bottom center of the resin moldbody 104 as described above, this causes a problem (1) that a steadyreflow bonding can not be ensured due to the cutting remain of the gateremain 106 when the reflow bonding to a wiring substrate 107 isconducted. In addition, if the gate remain 106 is formed at the bottomcenter of the resin mold body 104, this causes a problem (2) that whenthe lead frames 102, 103 are bended, the bending work is disturbed sincea bending machine is caught in the cutting remain of the gate remain106.

Further, in the molding method 1, since a thermoplastic resin is used, afluidity of the resin is low, and as a result, the molding method 1 isinappropriate for molding the resin mold body 104 having a complexshape. In addition, there has been a problem (3) that a thermoplasticresin is poor in heat resistance and adhesiveness to the lead frame.

Therefore, a method for solving the problems described above has beenconsidered, in which an injection port is disposed on an external wallportion 116 (see FIG. 11) of the upper die 111 or lower die 112 and athermosetting resin is injected from the injection port to mold theresin mold body 104.

For example, an invention is described in the Japanese Patent Laid-openPublication No. 2006-156704 or the Japanese Patent Laid-open PublicationNo. 2005-294736, in which a thermosetting resin is injected into a spacebetween the upper die and the lower die by a transfer molding. In themolding method described above, there is no specific description on thearrangement of injection port and an injecting direction. However, sincea gate is disposed on an external side surface of the resin mold body,for example, by disposing the injection port on the external wallportion (see 116 in FIG. 11) of the upper die, the problem (1) andproblem (2) can be solved. In addition, since a thermosetting resin isexcellent in fluidity, heat resistance, and adhesiveness to lead frames,the problem (3) can be solved (hereinafter, this molding method isreferred to as “conventional method”).

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention

However, in the conventional method, there has been a problem that aweld line is formed in the resin mold body due to injection of athermosetting resin from a side of the upper die. The weld line is abuffer layer in an interface portion produced by various kinds ofexternal factors such as a fluidity of resin, a variation of resinviscosity, a time difference between injected resins, and the like whenthe thermosetting resin is injected into the space.

Here, FIG. 12 is an illustration showing one embodiment of theconventional method, which is a cross section of an upper die in planview.

As shown in FIG. 12, in the conventional method, for example, aninjection port 115′ is disposed at a position X of an upper die 111′directed to and perpendicular to a facing wall 118. In this case, aninjected thermosetting resin moves to a direction indicated by arrowsalong an outer periphery of a protruding portion 117 to fill the spacein a counterclockwise direction. As a result, it is supposed that a weldline is formed in the vicinity of a position Y.

If the resin mold body is formed as described above, a curing reactionof the first injected thermosetting resin at around the position Y isprogressed, while the curing reaction of just injected thermosettingresin is not progressed. In this case, a weld line formed as describedabove has been especially poor in strength and has caused cracks.

In addition, since a shape of the resin mold body has become complexcompared with the conventional light emitting device, a stress-focusingportion is likely to be formed. In addition, due to a secondary worksuch as cut and forming and deburring, or a thermal history of rapidheating and cooling in the reflow bonding, cracks has been likely to begenerated from the weld line which is poor in strength.

Especially, if a resin having a large thermal expansion coefficient suchas silicone resin or modified silicone resin is used for a resin 108shown in FIG. 10, the resin 108 largely expands and contracts in theheating and cooling. Due to the expansion and contraction of the resin108, a huge stress has been generated in the resin mold body 104 togenerate cracks in the weld portion which is poor in strength.

The present invention has been developed for solving the problemsdescribed above, and it is, therefore, an object of the presentinvention to provide a light emitting device, a package, a manufacturingmethod of the light emitting device, a manufacturing method of thepackage, and a package manufacturing die, each of which can suppressgeneration of cracks in a resin mold body having a circular orellipsoidal concave portion at the center of the resin mold body.

Means for Solving the Problems

Therefore, a light emitting device according to the present invention,which includes: a light emitting element; a first resin mold body havingan external side surface, provided with a concave portion having acircular shape or ellipsoidal shape in plan view at a center of thefirst resin mold, and made of a first thermosetting resin; a pluralityof lead frames arranged on a bottom surface of the concave portion andelectrically connected to the light emitting element; and a second resinmold body made of a second thermosetting resin filled in the concaveportion, wherein the light emitting element is placed on the lead frameand a surface of the second resin mold body serves as a light emittingsurface, is characterized in that a gate remain, which is formed bycutting off a gate to be formed on the external side surface of thefirst resin mold body when the first thermosetting resin is injectedinto a predetermined die, is formed on an extended line of a normal lineat one point of a circular cross section or ellipsoidal cross section ofthe concave portion toward a normal line direction.

According to the feature described above, the first thermosetting resinat the time of injection flows toward the normal direction of theconcave portion, and hits against a portion corresponding to the concaveportion of the die to split. Each of the split flows of the firstthermosetting resin intermingles with each other at a position oppositeto the injection port across the center of the concave portion.Therefore, a time until the intermingling can be shortened compared withthe conventional method, and thereby the each of the split flows of thefirst thermosetting resin joins together and intermingles with eachother to cause a sufficient curing reaction. As a result, a strong weldline can be formed.

In addition, a gate remain according to the present invention ischaracterized in that the gate remain is perpendicularly disposed on theexternal side surface. According to the feature described above, sincethe first thermosetting resin at the time of injection hits against aportion corresponding to the concave portion of the die and splitssubstantially equally, the time until the intermingling can beshortened. In addition, since each of the split flows of the firstthermosetting resin joins together and intermingles with each other tocause a sufficient curing reaction, a strong weld line can be formed.

In addition, a first resin mold body according to the present inventionis characterized in that the first resin mold body is made of a resincontaining triazine derivative epoxy resin. Especially, it is preferablethat the first resin mold body is made of a resin containing1,3,5-triazine derivative epoxy resin. A curing reaction of the firstthermosetting resin described above is fast and a robust first resinmold body can be formed. In addition, since the time until theintermingling can be shortened compared with the conventional method byarranging the injection port as described above even if a curingreaction speed of the first thermosetting resin is increased, amanufacturing speed of the first resin mold body can be synergisticallyincreased.

In addition, a package according to the present invention, whichincludes: a first resin mold body having an external side surface andprovided with a concave portion having a circular shape or ellipsoidalshape in plan view at a center of the first resin mold body; and aplurality of lead frames arranged on a bottom surface of the concaveportion, is characterized in that a gate remain, which is formed bycutting off a gate to be formed on the external side surface of thefirst resin mold body when a first thermosetting resin is injected intoa predetermined die, is formed on an extended line of a normal line atone point of a circular cross section or ellipsoidal cross section ofthe concave portion toward a normal line direction.

According to the feature described above, the first thermosetting resinat the time of injection flows toward the normal line direction of theconcave portion, and hits against a portion corresponding to the concaveportion of the die to split. Each of the split flows of the firstthermosetting resin intermingles with each other at a position oppositeto the injection port across the center of the concave portion. As aresult, the time until the intermingling can be shortened compared withthe conventional method. In addition, since the each of the split flowsof the first thermosetting resin joins together and intermingles witheach other to cause a sufficient curing reaction, a strong weld line canbe formed.

In addition, a gate remain according to the present invention ischaracterized in that the gate remain is perpendicularly disposed on theexternal side surface. According to the feature described above, sincethe first thermosetting resin at the time of injection hits against aportion corresponding to the concave portion of the die and splitssubstantially equally, each of the split flows of the firstthermosetting resin joins together and intermingles with each other tocause a sufficient curing reaction. As a result, a stronger weld linecan be formed.

In addition, a first resin mold body according to the present inventionis characterized in that the first resin mold body is made of a resincontaining triazine derivative epoxy resin. Especially, it is preferablethat the first resin mold body is made of a resin containing1,3,5-triazine derivative epoxy resin. A curing reaction of the firstthermosetting resin described above is fast and a robust first resinmold body can be formed. In addition, since the time until theintermingling can be shortened compared with the conventional method byarranging the injection port as described above even if a curingreaction speed of the first thermosetting resin is increased, amanufacturing speed of the first resin mold body can be synergisticallyincreased.

In addition, a package manufacturing die according to the presentinvention for manufacturing a package, which includes: a first resinmold body having an external side surface and provided with a concaveportion having a circular shape or ellipsoidal shape in plan view at acenter of the first resin mold body and a plurality of lead framesarranged on a bottom surface of the concave portion, is characterized inthat the package manufacturing die includes a pair of an upper die and alower die, wherein the upper die or the lower die is provided withrecesses where the lead frames are disposed, wherein the upper dieincludes: an external wall portion formed in a frame shape; a protrudingportion whose a bottom surface is in contact with a plurality of thelead frames and used for forming the concave portion; a concave grooveportion formed between the external wall portion and the protrudingportion; and an injection port disposed in the external wall portion andon an extended line of a normal line at one point of a circular crosssection or ellipsoidal cross section of the protruding portion toward anormal line direction.

According to the feature described above, the first thermosetting resinat the time of injection flows toward the normal line direction of theprotruding portion and hits against the protruding portion to split.Each of the split flows of the first thermosetting resin fills the spacealong an outer periphery of the protruding portion and intermingles witheach other at a position opposite to the injection port across thecenter of the protruding portion. Therefore, a time until theintermingling can be shortened compared with the conventional method,and thereby the each of the split flows of the first thermosetting resinjoins together and intermingles with each other to cause a sufficientcuring reaction. As a result, a strong weld line can be formed.

In addition, an injection port according to the present invention ischaracterized in that the injection port is perpendicularly disposed onthe external wall portion. According to the configuration describedabove, since the first thermosetting resin at the time of injection hitsagainst a portion, with which the concave portion is formed, of the dieand splits, each of the split flows of the first thermosetting joinstogether and intermingles with each other to cause a sufficient curingreaction. Accordingly, a stronger weld line can be formed.

In addition, a manufacturing method according to the present inventionfor manufacturing a light emitting device, which includes: a lightemitting element; a first resin mold body having an external sidesurface and provided with a concave portion having a circular shape orellipsoidal shape in plan view at a center of the first resin mold body;a plurality of lead frames arranged on a bottom surface of the concaveportion and electrically connected to the light emitting element; and asecond resin mold body made of a second thermosetting resin filled inthe concave portion, wherein the light emitting element is placed on thelead frame and a surface of the second resin mold serves as a lightemitting surface, is characterized in that the manufacturing methodincludes steps of: a first process for sandwiching the lead frames by anupper die, which is provided with a protruding portion to be contactedwith the lead frames and used for forming the concave portion, and alower die paired with the upper die; a second process for injecting afirst thermosetting resin into a space formed by the upper die and thelower die toward a normal line direction of a circular cross section orellipsoidal cross section of the protruding portion; a third process forheating up the injected first thermosetting resin for curing; a fourthprocess for releasing the upper die; a fifth process for cutting off agate formed in the injection port portion; a sixth process for placingthe light emitting element on the lead frame to be arranged on a bottomsurface of the concave portion and electrically connecting the lightemitting element and the lead frame; a seventh process for filling asecond thermosetting resin in the concave portion; and an eighth processfor heating up the second thermosetting resin for curing.

According to the feature described above, the first thermosetting resinat the time of injection flows toward the normal line direction of thecircular cross section or ellipsoidal cross section of the protrudingportion, and hits against the protruding portion to split. Each of thesplit flows of the first thermosetting resin fills the space along theouter periphery of the protruding portion, and intermingles with eachother at a position opposite to the injection port across the center ofthe protruding portion. Therefore, a time until the intermingling can beshortened compared with the conventional method, and thereby the each ofthe split flows of the first thermosetting resin joins together andintermingles with each other to cause a sufficient curing reaction. As aresult, a strong weld line can be formed.

In addition, a first thermosetting resin according to the presentinvention is characterized in that the first thermosetting resin is aresin containing triazine derivative epoxy resin. Especially, it ispreferable that the first resin mold body is made of a resin containing1,3,5-triazine derivative epoxy resin. A curing reaction of the firstthermosetting resin described above is fast and a robust first resinmold body can be formed. In addition, since the time until theintermingling can be shortened compared with the conventional method byarranging the injection port as described above even if a curingreaction speed of the first thermosetting resin is increased, amanufacturing speed of the first resin mold body can be synergisticallyincreased.

In addition, a manufacturing method according to the present inventionfor manufacturing a package, which includes a first resin mold bodyhaving a plurality of external side surfaces and provided with a concaveportion having a circular shape or ellipsoidal shape in plan view at acenter of the first resin mold body and a plurality of lead framesarranged on a bottom surface of the concave portion, is characterized inthat the manufacturing method includes steps of: a first process forsandwiching the lead frames by un upper die, which is provided with aprotruding portion to be contacted with the lead frames and used forforming the concave portion, and a lower die paired with the upper die;a second process for injecting a first thermosetting resin into a spaceformed by the upper die and the lower die toward a normal line directionof a circular cross section or ellipsoidal cross section of theprotruding portion; a third process for heating up the injected firstthermosetting resin for curing; a fourth process for releasing the upperdie; and a fifth process for cutting off a gate formed in the injectionport portion.

According to the feature described above, the first thermosetting resinat the time of injection flows toward the normal line direction of thecircular cross section or ellipsoidal cross section of the protrudingportion, and hits against the protruding portion to split. Each of thesplit flows of the first thermosetting resin fills the space along theouter periphery of the protruding portion, and intermingles with eachother at a position opposite to the injection port across the center ofthe protruding portion. Therefore, a time until the intermingling can beshortened compared with the conventional method, and since a temperaturedifference between the each of the split flows of the firstthermosetting resin can be reduced, a strong weld line can be formed.

In addition, a first thermosetting resin according to the presentinvention is characterized in that the first thermosetting resin is aresin containing triazine derivative epoxy resin. Especially, it ispreferable that the first resin mold body is made of a resin containing1,3,5-triazine derivative epoxy resin. A curing reaction of the firstthermosetting resin described above is fast and a robust first resinmold body can be formed. In addition, since the time until theintermingling can be shortened compared with the conventional method byarranging the injection port as described above even if a curingreaction speed of the first thermosetting resin is increased, amanufacturing speed of the first resin mold body can be synergisticallyincreased.

Effects of the Invention

According to the light emitting device and package of the presentinvention, since the light emitting device and package has the firstresin mold body provided with the strong weld line, the light emittingdevice and package can be prevented from generating cracks. In addition,according to the package manufacturing die described above, since thefirst resin mold body provided with the strong weld line can be formed,the package can be prevented from generating cracks. According to themanufacturing method of the light emitting device and manufacturingmethod of the package, since the first resin mold body provided with thestrong weld line can be formed, the light emitting device and packagecan be prevented from generating cracks. Especially, if a resin having alarge thermal expansion coefficient such as silicone resin or modifiedsilicone resin is used for the second resin mold body, the second resinmold body largely expands and contracts on heating and cooling. Due tothe expansion and contraction of the second resin mold body at the time,an extremely large stress is generated in the first resin mold body.However, since a sufficient strength is secured in the weld portion, thelight emitting device and package can be prevented from generatingcracks.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing a light emitting device accordingto a first embodiment of the present invention;

FIG. 2 is an illustration showing a light emitting device according tothe first embodiment of the present invention, and which is a crosssectional view taken along A-A line of FIG. 1;

FIG. 3 is a plan view showing a light emitting device according to thefirst embodiment of the present invention;

FIG. 4 is a perspective view showing a die for manufacturing a packagein a method for manufacturing a light emitting device according to thefirst embodiment of the present invention;

FIG. 5A is a cross sectional view showing an arrangement process of amethod for manufacturing a light emitting device according to the firstembodiment of the present invention;

FIG. 5B is a cross sectional view showing a first process of the methodfor manufacturing the light emitting device according to the firstembodiment of the present invention;

FIG. 5C is a cross-sectional view showing a second process to a fourthprocess of the method for manufacturing the light emitting deviceaccording to the first embodiment of the present invention;

FIG. 5D is a cross sectional view showing a fifth process and a sixthprocess of the method for manufacturing the light emitting deviceaccording to the first embodiment of the present invention;

FIG. 5E is a cross sectional view showing a seventh process and aneighth process of the method for manufacturing the light emitting deviceaccording to the first embodiment of the present invention;

FIG. 6 is an illustration showing an upper die according to the firstembodiment of the present invention, and which is a plan cross sectionalview taken along B-B line of FIG. 5C;

FIG. 7 is a plan view showing a first modified example of a package ofthe present invention;

FIG. 8 is a plan view showing a second modified example of a package ofthe present invention;

FIG. 9 is a plan view showing a third modified example of a package ofthe present invention;

FIG. 10 is a side cross sectional view showing a conventional lightemitting device of the Japanese Patent Laid-open Publication No.2005-259972 or the Japanese Patent Laid-open Publication No.2001-177160;

FIG. 11 is a side cross sectional view showing a method for molding aconventional resin mold body; and

FIG. 12 is an illustration showing one embodiment of a conventionalmethod, and which is a plan cross sectional view of an upper die.

EXPLANATION ON SYMBOLS

-   1 Light emitting device-   2 Light emitting element-   10 First resin mold body-   10 a Concave portion-   11 External side surface-   20 First lead frame-   30 Second lead frame-   50 Gate remain-   60 Weld line-   70 Upper die-   71 Lower die-   73 External wall portion-   75 Protruding portion-   77 Injection port-   90 Package-   J First thermosetting resin-   K Package manufacturing die

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, best modes of a light emitting device, a package, a die formanufacturing the package, a method for manufacturing the light emittingdevice, and a method for manufacturing the package of the presentinvention will be explained in details by referring to drawings.

First Embodiment

FIG. 1 is a perspective view showing a light emitting device accordingto a first embodiment of the present invention. FIG. 2 is anillustration showing the light emitting device according to the firstembodiment of the present invention, and which is a cross sectional viewtaken along A-A line of FIG. 1. FIG. 3 is a plan view showing the lightemitting device according to the first embodiment of the presentinvention.

The light emitting device 1 according to the first embodiment includes alight emitting element 2, a first resin mold body 10 on which the lightemitting element 2 is placed, a first lead frame 20 and a second leadframe 30 which are arranged underneath the first resin mold body 10 andelectrically connected to the light emitting element 2, and a secondresin mold body 40 to be filled in a concave portion 10 a of the firstresin mold body 10. In addition, a gate remain 50 is formed on a sidesurface of the first resin mold body 10 and a weld line 60 is formedinside the first resin mold body 10.

<First Resin Mold Body>

The first resin mold body 10 is, as shown in FIG. 1, a base of the lightemitting device 1 and a member for having a light of the light emittingelement 2, which is arranged in a lower portion of the first resin moldbody 10, effectively output. The first resin mold body 10 hassubstantially a rectangular solid shape and is provided with a concaveportion 10 a at the center. An external side surface on which a gateremain 50 is formed among four side surfaces composing the first resinmold body 10 is named a first external side surface 11 a. The other sidesurfaces are named a second external side surface 11 b, a third externalside surface 11 c, and a fourth external side surface 11 d,respectively, in the clockwise direction from the first external sidesurface 11 a.

The concave portion 10 a includes a side surface portion 10 b and abottom surface 10 c, and has a circular truncated cone shape whichbecomes narrower toward the bottom surface 10 c. A light emitted fromthe light emitting element 2 is reflected by the side surface portion 10b, and can be focused or diffused by changing an angle of the sidesurface portion 10 b. The bottom surface 10 c is composed of a firstlead frame 20, a second lead frame 20, and a gap 10 e which is a part ofthe first resin mold body 10, which will be described later. The gap 10e is disposed between the first lead frame 20 and the second lead frame30 so that no short-circuit is formed between the first lead frame 20and the second lead frame 30. Regarding a slope angle of the sidesurface portion 10 b, it is preferable that an opening angle of the sidesurface portion 10 b from the bottom surface is not less than 95 degreesand not more than 150 degrees, and more preferably not less than 100degrees and not more than 120 degrees.

It is noted that the concave portion 10 a may be formed in a cylindricalform without forming a slope. In addition, the side surface portion 10 bis not always required to be flat, but may be formed irregular forimproving adhesiveness of the interface between the first resin moldbody 10 and a second resin mold body 40 described later. In addition,although the concave portion 10 a is formed in a circular shape in planview in the first embodiment, but may be formed in an ellipsoidal shape.In addition, although the first resin mold body 10 is formed in arectangular shape, but may be formed in a circular shape, an ellipsoidalshape, or other polygonal shapes in plan view.

It is preferable that the first resin mold body 10 is excellent in heatresistance and light resistance, as well as rigid for protecting thelight emitting element 2. Therefore, the first resin mold body 10 ismade of a first thermosetting resin containing triazine derivative epoxyresin. The first thermosetting resin is excellent in heat resistance andlight resistance, as well as excellent in adhesiveness to the first leadframe 20 and the second lead frame 30. In addition, since the firstthermosetting resin is excellent in fluidity, the first thermosettingresin can be filled well even in the first resin mold body (die), whichhas a complex shape. In addition, the first thermosetting resin containsacid anhydride, antioxidant, a mold release agent, a light reflectivematerial, a inorganic filler, a curing catalyst, a light stabilizer, andan antifriction. Titanium dioxide is used for the light reflectivematerial and the light reflective material occupies 10 to 60 wt/%(weight percentage) in the first thermosetting resin. It is noted thatthe first resin mold body 10 is formed to reflect not less than 70% of alight having a wavelength not less than 430 nm.

In the first embodiment, the first resin mold body 10 is formed asdescribed above. However, the first resin mold body 10 may be formed inother configurations. For example, the first thermosetting resin may becomposed of at least one selected from a group of epoxy resin, modifiedepoxy resin, silicone resin, modified silicone resin, aclyrate resin,and urethane resin. For example, a solid epoxy resin composition may beused. The solid epoxy resin composition is prepared as follows. Epoxyresin composed of triglycidylisocyanurate (chemical 1),bisphenolAdiglycidyletherhydride (chemical 2), and others and acidanhydride, which has an equivalent weight of that of the epoxy resin,composed of hexahydrophthalic acid anhydride (chemical 3),3-methylhexahydrophthalic acid anhydride (chemical 4),4-methylhexahydrophthalic acid anhydride (chemical 5) and others aremixed to prepare a transparent and colorless mixture of 100 weightparts. Next, DBU (1,8-Diazabicycro(5,4,0) undecene-7) (chemical 6) of0.5 weight parts as a curing promoter, ethylene glycol (chemical 7) of 1weight part as a catalyst prompter, titanium oxide pigment of 10 weightparts, and glass fibers of 50 weight parts are added to the mixture andheated up for partially promoting curing reaction to form B-staged solidepoxy resin composition.

In addition, it is no object whether the first resin mold body 10 istransparent or not, and the first resin mold body 10 may be designed asappropriate according to, for example, the application. For example, alight which transmits the first resin mold body 10 may be reduced bymixing a light blocking material into the first thermosetting resin. Onthe other hand, a diffusing agent may be mixed into the firstthermosetting resin so that a light emitted from the light emittingdevice 1 is mainly output to a light emitting surface and the sidesurfaces. In addition, a white pigment rather than dark pigment may beadded for reducing absorption of the light. As described above, thefirst thermosetting resin may be mixed as appropriate with at least oneselected from a group of a diffusing agent, pigment, fluorescentmaterial, reflective material, light blocking material, lightstabilizer, and lubricant for giving a predetermined function to thefirst resin mold body 10.

It is noted that a stress-focusing portion is generated in the firstresin mold body 10 by expansion and contraction of a secondthermosetting resin used for a second resin mold body 40 describedlater. Therefore, it is preferable that the first resin mold body 10 isdesigned so that a weld line 60 described later is not overlapped on thestress-focusing portion.

<First Lead, Second Lead>

The first lead frame 20 and the second lead frame 30 are a pair ofelectrodes of positive electrode and negative electrode whichelectrically connect external electrodes (not shown) and the lightemitting element 2 as shown in FIG. 1 to FIG. 3. The first lead frame 20and the second lead frame 30 are metal plates disposed beneath the firstresin mold body 10 with a given gap (gap 10 e), and extend to each sideof the first resin mold body 10, respectively, from the bottom portion10 c of the concave portion 10 a.

The first lead frame 20 includes, as shown in FIG. 2, a first inner leadportion 20 a forming the bottom surface 10 c of the concave portion 10 aand a first outer lead portion 20 b exposed outside from the first resinmold body 10. A back side of the first lead frame 20 is also called asthe first outer lead portion 20 b.

The first inner lead portion 20 a composes a part of the bottom surface10 c of the concave portion 10 a, and the light emitting element 2 isplaced on the first inner lead portion 20 a through a die bondingmember. The first inner lead portion 20 a and the light emitting element2 are electrically connected through a wire W. The first inner leadportion 20 a is required to have an area in which at least the lightemitting element 2 can be placed. However, a larger area is preferablein consideration of, for example, a thermal conductivity, electricconductivity, and reflection efficiency. The first outer lead portion 20b is electrically connected to an external electrode, as well as has athermal conducting function.

The second lead frame 30 includes a second inner lead portion 30 aforming the bottom surface 10 c of the concave portion 10 a and a secondouter lead portion 30 b exposed outside from the first resin mold body10. A backside of the second lead frame 30 is also called as the secondouter lead portion 30 b.

The second inner lead portion 30 a composes a part of the bottom surface10 c of the concave portion 10 a, and electrically connected to thelight emitting element 2 through the wire W. The second inner leadportion 30 a is required to have an area to which at least an electrodeof the light emitting element 2 can be connected. However, a larger areais preferable in consideration of the reflection efficiency.

It is noted that in the first embodiment, as shown in FIG. 3, a surfacearea of the first inner lead portion 20 a is formed larger than that ofthe second inner lead portion 30 a, both of the surface areas form thebottom surface 10 c, for placing the light emitting element 2 on thefirst inner lead portion 20 a.

The first inner lead portion 20 a and the second inner lead portion 30 aare formed to have the same surface height as shown in FIG. 2. With thisconfiguration, a mounting stability of the light emitting device 1 canbe improved, as well as electrical wirings can be implemented frombacksides of the first lead frame 20 and the second lead frame 30.

The first lead frame 20 and the second lead frame 30 are formed using anelectrically good conductor, for example, iron, phosphor bronze, cupperalloy, or the like. In addition, the first lead frame 20 and the secondlead frame 30 may be metal-plated by, for example, silver, aluminum,cupper, and gold for increasing a reflection efficiency of a lightemitted from the light emitting element 2. In addition, it is preferablethat surfaces of the first lead frame 20 and the second lead frame 30are formed to be smooth for increasing surface reflection efficienciesof the first lead frame 20 and the second lead frame 30. In addition,areas of the first lead frame 20 and the second lead frame 30 may beformed larger for increasing heat dissipations of the first lead frame20 and the second lead frame 30. Through this, a temperature rise of thelight emitting element 2 can be effectively suppressed, and as a result,a relatively high current can be flown in the light emitting element 2.

In addition, the first lead frame 20 and the second lead frame 30 may beformed thick to increase the heat dissipation. In this case, since aforming work such as a bending work of the first lead frame 20 and thesecond lead frame 30 becomes difficult, it is preferable that the firstlead frame 20 and the second lead frame 30 are formed after cutting araw material in a predetermined size. In addition, if the first leadframe 20 and the second lead frame 30 are formed thick, the lightemitting element 2 can be easily placed due to reductions of deflectionsof the first lead frame 20 and the second lead frame 30. On the otherhand, if the first lead frame 20 and the second lead frame 30 are formedwith a thin plate, the bending work becomes easy to form a predeterminedshape with ease. In addition, in the first embodiment, the first leadframe 20 and the second lead frame 30 are formed in a rectangular shapein plan view, however, may be formed in another shape. As with the firstembodiment, at least a pair of electrodes of positive electrode andnegative electrode (first lead frame 20 and second lead frame 30) arerequired. However, more than three lead frames may be disposed.

It is noted that a molded product composed of the first resin mold body10, the first lead frame 20, and the second lead frame 30 is called apackage.

<Second Resin Mold Body>

A second resin mold body 40 is, as shown in FIG. 1, a member for havinga light emitted from the light emitting element 2 effectively outputoutside, as well as protecting the light emitting element 2 fromexternal forces, dusts, and moisture from the external environment.

In the first embodiment, the second resin mold body 40 is made of asecond thermosetting resin which contains triazine derivative epoxyresin. It is preferable that the second thermosetting resin is composedof at least one selected from a group of silicon-containing resin, epoxyresin, modified epoxy resin, silicone resin, modified silicone resin,acrylate resin, and urethane resin. Especially, epoxy resin, modifiedepoxy resin, silicone resin, and modified silicone resin are preferable.

In the first embodiment, both of the first resin mold body 10 and thesecond resin mold body 40 are made of thermosetting resins, and sincethe thermosetting resins having a similar physical property, forexample, a thermal expansion coefficient are selected, adhesivenessbetween the first resin mold body 10 and the second resin mold body 40is excellent. Further, the light emitting device 1 which is excellent inheat resistance, light resistance, and fluidity may be provided.

A hard resin is preferable for the second resin mold body 40 forprotecting the light emitting element 2. In addition, it is preferablethat a thermosetting resin excellent in heat resistance, weatherresistance, and light resistance is used for the second resin mold body40. The second resin mold body 40 may be mixed with at least oneselected from a group of a filler, diffusing agent, pigment, fluorescentmaterial, and reflective material for giving a predetermined function.In addition, the second thermosetting resin may include a diffusingagent. As a specific diffusing agent, for example, barium titanate,titanium oxide, aluminum oxide, and silicon oxide may be preferablyused. In addition, an organic or inorganic color dye or color pigmentmay be included for cutting a light of non-desired wavelengths.

In addition, in each embodiment, the explanation has been made, but notin details, such that a fluorescent material to be mixed into the secondresin mold body 40 absorbs a light emitted from the light emittingelement 2 and converts a wavelength of the light into others.Specifically, the following fluorescent materials are preferably used.Namely, it is preferable that the fluorescent material is at least oneselected from a group of, for example, nitride fluorescent materials,oxynitride fluorescent materials, and sialon fluorescent materials, allof which are activated mainly by lanthanoid elements such as Eu and Ce,alkaline earth halogen apatite fluorescent materials, alkaline earthmetal boric-acid halogen fluorescent materials, alkaline earth metalaluminate fluorescent materials, alkaline earth silicates, alkalineearth sulfides, alkaline earth thiogallates, alkaline earth siliconnitrides, and germinates, all of which are activated mainly by anelement of lanthanoid elements such as Eu and transition metals such asMn, or rare earth aluminates and rare earth silicates, all of which aremainly activated by lanthanoid elements such as Ce, or organics andorganic complexes which are activated mainly by lanthanoid elements suchas Eu. Specifically, the following fluorescent materials may be used,but not limited to these.

The nitride fluorescent materials to be activated mainly by lanthanoidelements such as Eu and Ce are, for example, M₂Si₅N₈:Eu and CaAlSiN₃:Eu(M is at least one selected from a group of Sr, Ca, Ba, Mg, and Zn). Inaddition, the nitride fluorescent materials are, for example,MSi₇N₁₀:Eu, M_(1.8)Si₅O_(0.2)N₈:Eu, and M_(0.9)Si₇O_(0.1)N₁₀:Eu (M is atleast one selected from a group of Sr, Ca, Ba, Mg, and Zn).

One of the oxynitride fluorescent materials to be activated mainly bylanthanoid elements such as Eu and Ce is, for example, MSi₂O₂N₂:Eu (M isat least one selected from a group of Sr, Ca, Ba, Mg, and Zn).

One of the sialon fluorescent materials to be activated mainly bylanthanoid elements such as Eu and Ce is, for example,M_(p/2)Si_(12−p−q)Al_(p+q)O_(q)N_(16−p):Ce, which is composed ofM-Al—Si—O—N (M is at least one selected from a group of Sr, Ca, Ba, Mg,and Zn, q:0 to 2.5, p:1.5 to 3).

One of the alkaline earth halogen apatite fluorescent materials to beactivated mainly by an element of lanthanoid elements such as Eu andtransition metals such as Mn is, for example, M₅(PO₄)₃X:R (M is at leastone selected from a group of Sr, Ca, Ba, Mg, and Zn. X is at least oneselected from a group of F, Cl, Br, and I. R is at least one selectedfrom a group of Eu, Mn, and Eu+Mn.)

One of the alkaline earth metal boric-acid halogen fluorescent materialsis, for example, M₂B₅O₉X:R (M is at least one selected from a group ofSr, Ca, Ba, Mg, and Zn. X is at least one selected from a group of F,Cl, Br, and I. R is at least one selected from a group of Eu, Mn, andEu+Mn.).

The alkaline earth metal aluminate fluorescent materials are, forexample, SrAl₂O₄:R, Sr₄Al₁₄O₂₅:R, CaAl₂O₄:R, BaMg₂Al₁₆O₂₇:R,BaMg₂Al₁₆O₁₂:R, and BaMgAl₁₀O₁₇:R (R is at least one selected from agroup of Eu, Mn, and Eu+Mn.).

The alkaline earth sulfide fluorescent materials are, for example,La₂O₂S:Eu, Y₂O₂S:Eu, and Gd₂O₂S:Eu.

One of the rare earth aluminate fluorescent materials to be activatedmainly by an element of lanthanoid elements such as Ce is, for example,a YAG fluorescent material which is expressed with the followingcompositional formulas Y₃Al₅O₁₂:Ce, (Y_(0.8)Gd_(0.2))₃Al₅O₁₂:Ce,Y₃(Al_(0.8)Ga_(0.2))₅O₁₂:Ce, and (Y,Gd)₃(Al, Ga)₅O₁₂. In addition, therare earth aluminate fluorescent materials are, for example,Tb₃Al₅O₁₂:Ce and Lu₃Al₅O₁₂:Ce, in which a part or all of Y in the YAGfluorescent material are substituted by, for example, Tb or Lu.

A fluorescent material other than those described above is, for example,ZnS:Eu, Zn₂GeO₄:Mn, and MGa₂S₄:Eu (M is at least one selected from agroup of Sr, Ca, Ba, Mg, and Zn. X is at least one selected from a groupof F, Cl, Br, and I.)

The fluorescent materials described above may include at least oneselected from a group of Tb, Cu, Ag, Au, Cr, Nd, Dy, Co, Ni, and Tiinstead of Eu or in addition to Eu as needed.

In addition, a fluorescent material other than those described above maybe used as long as the fluorescent material has an equal performance andeffect to those described above.

A fluorescent material which has an emission spectrum of yellow, red,green, or blue through an excitation light of the light emitting element2 may be used. In addition, a fluorescent material which has an emissionspectrum of yellow, blue-green, or orange, which is an additive color ofthe above colors, may also be used. By combining these fluorescentmaterials variously, a light emitting device which emits various kindsof emission spectra may be manufactured.

For example, the fluorescent material Y₃Al₅O₁₂:Ce or

(Y_(0.8)Gd_(0.2))₃Al₅O₁₂:Ce is irradiated with a blue light emitted froma GaN compound semiconductor for converting a wavelength of the bluelight. Therefore, for example, a light emitting device which emits awhite light, which is a mixed color of the blue light emitted from thelight emitting element 2 and a light emitted from the fluorescentmaterial, can be provided.

For example, by using fluorescent materials composed of CaSi₂O₂N₂:Eu orSrSi₂O₂N₂:Eu which emits green to yellow, (Sr, Ca)₅(PO₄)₃Cl:Eu whichemits blue, and (Ca, Sr)₂Si₅N₈:Eu which emits red, a light emittingdevice which emits a white light, which has an excellent color renderingproperty, can be provided. In this case, since red, blue, and green,that is, the three primary colors, are used, a desired white light canbe obtained only by changing compounding ratios of the first fluorescentmaterial and the second fluorescent material.

<Gate Remain>

As shown in FIG. 1, the gate remain 50 is a protrusion of a resin moldbody remaining at an injection port through a cutting process, which isa secondary work, of the resin mold body formed in the injection portportion when the first thermosetting resin is injected from theinjection port (see injection port 77 in FIG. 4) of a die, which will bedescribed later.

In the first embodiment, the gate remain 50 is formed to protrudeperpendicular to the first external side surface 11 a of the first resinmold body 10. In the first embodiment, since a cross section of theinjection port is a semicircular shape, the gate remain 50 has acolumnar shape having a semicircular cross section. That is, a shape ofthe gate remain 50 is formed in accordance with the cross section of theinjection port.

<Weld Line>

As shown in FIG. 1, the weld line 60 is a buffer layer in an interfaceportion produced by various kinds of external factors such as a fluidityof resin, a variation of resin viscosity, a time difference betweeninjected resins, and the like when the first thermosetting resin isinjected.

The weld line 60 is formed at a position where each of the split flowsof the first thermosetting resin injected from an injection port of adie described later intermingles with each other. In the firstembodiment, since the first thermosetting resin is injected from thefirst external side surface 11 a on which the gate remain 50 exists, theweld line 60 is formed at a position opposite to the gate remain 50across the center of the concave portion 10 a. That is, in the firstembodiment, the weld line 60, the center of the concave portion 10 a,and the gate remain 50 are formed to be in line. Specifically, astress-focusing portion due to expansion and contraction of the secondthermosetting resin used for the second resin mold body 40 is producedin the first mold body 10. Therefore, it is preferable to design thefirst resin mold body 10 so that the stress-focusing portion is notoverlapped with the weld line 60 described later.

A relationship between the gate remain 50 and the weld line 60 will beexplained in details in the explanation of the manufacturing process.

<Light Emitting Element>

As shown in FIG. 2, the light emitting element 2 is a member to beplaced on the first inner lead portion 20 a and emits a light. Astructure where semiconductors, such as GaAlN, ZnS, ZnSe, SiC, GaP,GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, and AlInGaN are deposited on asubstrate as a light emitting layer is used in the light emittingelement 2. A semiconductor structure is a MIS junction, a homostructurehaving a PIN junction or a PN junction, a heterostructure, or a doubleheterostructure. Various emission wavelengths from ultraviolet toinfrared may be selected by changing a material of a semiconductor layerand a degree of mixed crystal of the material. The light emitting layermay be formed by a single quantum well structure or a multi quantum wellstructure, which is a thin film where a quantum effect appears.

If it is considered that the light emitting element 2 is used in thefield, it is preferable to use gallium nitride compound semiconductorsas a semiconductor material capable of fabricating a high intensitylight emitting element 2. In addition, it is preferable to use galliumaluminum arsenide semiconductors or aluminum indium gallium phosphidesemiconductors for obtaining a red light. However, various kinds ofsemiconductor materials may be used depending on the application.

As shown in FIG. 1, the wire W electrically connects the light emittingelement 2 and the first lead frame 20, and the light emitting element 2and the second lead frame 30. The wire W is required to form a goodohmic contact and a good mechanical connectivity with electrodes of thelight emitting element 2, and to have a good electric conductivity and agood thermal conductivity. It is preferable that the thermalconductivity is not less than 0.01 cal/(sec) (cm²) (° C./cm), and morepreferably not less than 0.5 cal/(sec) (cm²) (° C./cm). The wire W isdisposed for electric conduction from directly on the light emittingelement 2 to a wire bonding area where a wiring pattern is plated.

<Method for Manufacturing Light Emitting Device>

Next, a manufacturing method of a light emitting device according to thepresent invention will be explained. FIG. 4 is a perspective viewshowing a die for manufacturing a package in a method for manufacturinga light emitting device according to the first embodiment of the presentinvention. FIG. 5A to FIG. 5E are cross sectional views showing a methodfor manufacturing a light emitting device according to the firstembodiment of the present invention, in which FIG. 5A is an illustrationshowing an arrangement process, FIG. 5B is an illustration showing afirst process, FIG. 5C is an illustration showing a second process to afourth process, FIG. 5D is an illustration showing a fifth process and asixth process, and FIG. 5E is an illustration showing a seventh processand an eighth process.

In the method for manufacturing the light emitting device 1 according tothe first embodiment, as shown in FIG. 4 and FIG. 5A to FIG. 5E, a die(die K for manufacturing package) composed of an upper die 70 and alower die 71 is used. In the method, a package is molded by injectingthe first thermosetting resin into a space 79 formed between the upperdie 70 and the lower die 71 of the die K for manufacturing the packageby a transfer molding. First, the upper die 70 and the lower die 71 willbe explained.

As shown in FIG. 4, the upper die 70 includes a main body 72 which is aplate composing an upper portion of the upper die 70, external wallportion 73 formed like a frame from an edge of the main body 72, a firstrecess 74 a and a second recess 74 b formed on a pair of external wallportions 73 among the external wall portions 73, a protruding portion 75forming the concave portion 10 a of the first resin mold body 10, aconcave groove portion 76 formed between the external wall portion 73and the protruding portion 75, and an injection port 77 formed bycutting off a part of the external wall portion 73 through in ahorizontal direction.

The external wall portion 73 is perpendicularly protruded from the edgeof the main body 72, and includes a first external wall portion 73 a, asecond external wall portion 73 b, a third external wall portion 73 c,and a fourth external wall portion 73 d which form the first externalsurface 11 a, the second external surface 11 b, the third externalsurface 11 c, and the fourth external surface 11 d of the resin moldbody 10, respectively. That is, the external wall portion 73 is aportion for forming an external frame of the first resin mold body 10,and is formed in a rectangular shape in plan view in the firstembodiment. A shape of the external wall portion 73 may be formed asneeded depending on a desired shape of the first resin mold body 10.

The first recess 74 a is a place with which the first lead frame 20 (seeFIG. 1) closely comes in contact, and is formed by cutting off a lowerend face of the second external wall portion 73 b. A height h of thefirst recess 74 a is formed substantially identical to a thickness ofthe first lead frame 20.

The second recess 74 b is a place with which the second lead frame 30(see FIG. 1) closely comes in contact, and is formed by cutting off alower end face of the fourth external wall portion 73 d. A height h ofthe second recess 74 b is formed substantially identical to a thicknessof the second lead frame 30.

It is noted that if not less than three lead frames are arranged, arecess may be formed as appropriate depending on shapes and arrangementpositions of the lead frames.

The protruding portion 75 is a member disposed to be protruded at thecenter of the main body 72 to form the concave portion 10 a. Theprotruding portion 75 has a truncated cone shape which becomes narrowertoward downward. Therefore, a shape of the concave portion 10 a to beformed in the first resin mold body 10 is formed to become narrowertoward the bottom surface 10 c. The bottom surface of the protrudingportion 75 is formed flat so that the first lead frame 20 and the secondlead frame 30 come in contact with the bottom surface in a first processdescribed later. The protruding portion 75 may be formed as appropriatedepending on a desired shape of the concave portion 10 a of the firstresin mold body 10.

The concave groove portion 76 is a space surrounded by the main body 72and the external wall portion 73 except the protruding portion 75, wherethe space 79 (see FIG. 6) is formed by overlapping the upper die 70 withthe lower die 71 described later.

The injection port 77 is a through hole for injecting a firstthermosetting resin J, and formed at approximately the center of lowerend of the first external wall portion 73 a through in a horizontaldirection. The injection port 77 has a semicircular cross section, andis formed to become narrower toward an exit portion from an entranceportion of the injection port 77. In addition, in the first embodiment,the injection port 77 is formed directed to the center of the protrudingportion 75.

In addition, as shown in FIG. 5A, pin insertion holes 81, 81 passingthrough the main body 72 are formed on an upper portion of the upper die70. The pin insertion hole 81 is a hole for inserting a pin 82 when thefirst resin mold body is released from the upper die 70.

The lower die 71 is, as shown in FIG. 5A to FIG. 5C, a plate having apredetermined thickness, and a surface of the plate if formed flat. Thelower die 71 comes in contact with the upper die 70 to form the space79.

It is noted that shapes of the upper die 70 and the lower die 71 are notlimited to those described above, and may be changed as appropriate.Although not shown specifically, for example, a lower end face of theexternal wall portion 73 of the upper die 70 is formed flat withoutdisposing a recess and a bottom surface of the protruding portion 75 isformed to be the same height with the lower end face of the externalwall portion 73. On the other hand, a recess having a shape andthickness identical to those of the lead frame is formed in the lowerdie 71. Using the upper die and lower die described above, a packageidentical to that composed of the first resin mold body 10, the firstlead frame 20, and the second lead frame 30 of the light emitting device1 may also be manufactured.

Next, each manufacturing process will be explained.

First, as an arrangement process shown in FIG. 5A, the first lead frame20 and the second lead frame 30 (not shown) are arranged between theupper die 70 and the lower die 71. The first lead frame 20 and thesecond lead frame 30 are arranged with a gap 10 e (see FIG. 2) betweenthe frames 20, 30 for preventing short-circuit.

Next, as a first process shown in FIG. 5B, the first lead frame 20 andthe second lead frame 30 are sandwiched by the upper die 70 and thelower die 71. That is, a portion corresponding to the first inner leadportion 20 a (see FIG. 2) of the first lead frame 20 and a portioncorresponding to the second inner lead portion 30 a of the second leadframe 30 come in contact with a bottom surface of the protruding portion75. In this case, the space 79 is formed by the upper die 70 and thelower die 71, while the other end side of the first lead frame 20 andthe other end side of the second lead frame 30 are exposed outside ofthe upper die 70 and the lower die 71.

Then, as a second process shown in FIG. 5C, the first thermosettingresin J is injected into the space 79 which is formed by the upper die70 and the lower die 71 from the injection port 77 by transfer molding.Since the first lead frame 20 and the second lead frame 30 aresandwiched by the upper die 70 and the lower die 71, the first leadframe 20 and the second lead frame 30 are not flapped, thereby resultingin suppression of burr generation.

Then, the upper die 70 and the lower die 71 are heated up to heat up thefirst resin mold body J a predetermined time for curing (third process).

Then, as shown in FIG. 5C, the pin 82 is inserted in the pin insertionhole 81 to release the upper die 70 (fourth process). Through theprocesses described above, a package composed of the first resin moldbody 10, the first lead frame 20, and the second lead frame 30 iscompleted. It is noted that if the curing is not sufficient, the packageis heated up again to cure for obtaining a predetermined hardness.

Then, as shown in FIG. 5D, a gate 83 formed in the portion of theinjection port 77 is cut off by a well known cutting machine along thefirst external surface 11 a (see FIG. 1) (fifth process). Accordingly,the gate remain 50 is formed as a cutting remain of the gate 83.

Then, as shown in FIG. 5D, the light emitting element 2 is placed on anupper surface of the first lead frame 20, and the light emitting element2 and the first lead frame 20 as well as the light emitting element 2and the second lead frame 30 are electrically connected by the wires W,W, respectively (sixth process).

Then, as shown in FIG. 5E, the second thermosetting resin 40 is filledin the concave portion 10 a (seventh process). As a method for fillingthe second thermosetting resin 40, a falling-drop method is used. Usingthe falling-drop method, an air remaining in the concave portion 10 acan be effectively discharged. It is preferable that the secondthermosetting resin 40 is mixed with a fluorescent material. Hence, achroma control of the light emitting device can be easily implemented.It is noted that as a method for filling the second thermosetting resin,an injection means or an extrusion means may be used.

Then, the second thermosetting resin 40 is heated up for curing to moldthe second resin mold body (eighth process).

Through the processes described above, the light emitting device 1 canbe manufactured.

Here, a relationship between the gate 83 (gate remain 50) and the weldline 60 will be explained in combination with a flow state of the firstthermosetting resin J. FIG. 6 is an illustration showing an upper dieaccording to the first embodiment of the present invention, and which isa plan cross sectional view taken along B-B line of FIG. 5C.

As shown in FIG. 6, the injection port 77 is on an extended line of anormal line m of a circular cross section of the protruding portion 75,and disposed toward a direction of the normal line m. In addition, sincethe protruding portion 75 is formed at the center of the upper die 70, afirst space 79 a of the space 79 on the left of the normal line m and asecond space 79 b of the space 79 on the right of the normal line m areformed in substantially the same volume.

The first thermosetting resin J which is injected from the injectionport 77 moves in the direction of the normal line m of the protrudingportion 75, hits against the protruding portion 75, and splitssubstantially equally into two first thermosetting resins j1, j2. Eachof the first thermosetting resins j1, j2 flows along an outer peripheryof the protruding portion 75 to fill the first space 79 a and the secondspace 79 b.

Therefore, the first thermosetting resins j1, j2 intermingle with eachother at a position Z opposite to the injection port 77 across thecenter C of the protruding portion 75 to form the weld line 60 (see FIG.3). On the other hand, at a position of the injection port 77, the gate83 (see FIG. 5D) is formed, and the gate remain 50 is formed by cuttingoff the gate 83. The gate remain 50 formed as described above is formedtoward a normal direction of the concave portion 10 a.

That is, in the first embodiment, the gate remain 50, the center C ofthe protruding portion 75, and the weld line 60 are formed to be inline. Namely, since curing reactions of the first thermosetting resinsj1, j2 to intermingle with each other progress substantially equally,there is no temperature difference between each of the resins j1, j2 tointermingle with each other, thereby resulting in substantially uniformintermingling. As a result, a stronger weld line 60 can be formed.

As explained above, since the light emitting device 1 according to thefirst embodiment has a strong weld line 60, the light emitting device 1can be prevented from generating a crack. In addition, since the firstthermosetting resin J includes 1,3,5-triazine derivative epoxy resin,the curing reaction is fast and a robust first resin mold body can beformed. In addition, since a time until the first thermosetting resinsj1, j2 intermingle with each other can be shortened compared with theconventional method by disposing the injection port as described aboveeven if a speed of the curing reaction of the first thermosetting resinis increased, a manufacturing speed of the first resin mold body can besynergistically increased.

As described above, the light emitting device, the package, the die formanufacturing the package, the method for manufacturing the lightemitting device, and the method for manufacturing the package accordingto the present invention have been explained. However, variousmodifications are possible as appropriate without departing from thespirit and scope of the present invention. Herein after, modifiedexamples of the package according to the present invention will beexplained. It is noted that in the explanation of the modified examples,a member identical to that of the first embodiment is labeled the samesymbol, and a duplicated explanation with the first embodiment will beomitted.

First Modified Example

FIG. 7 is a plan view showing a first modified example of a packageaccording the present invention.

As shown in FIG. 7, a package 90 of the first modified example isdifferent from the first embodiment in that six lead frames 21 arearranged and that a shape of a concave portion 12 is an ellipsoidalshape in plan view. That is, the package 90 includes the first resinmold body 10 which has a rectangular shape in plan view and has thefirst external side surface 11 a, the second external side surface 11 b,the third external side surface 11 c, and fourth external side surface11 d, a first lead frame 21 a disposed at the center of the firstexternal side surface 11 a, a second lead frame 21 b and third leadframe 21 c disposed on the second external side surface 11 b with apredetermined interval, a fourth lead frame 21 d disposed at the centerof the third side surface 11 c, and a fifth lead frame 21 e and sixthlead frame 21 f disposed on the fourth external side surface 11 d with apredetermined interval. In addition, the first resin mold body 10 isprovided with the concave portion 12 at the center thereof, and a gateremain 51 is formed on an extended line of a normal line m of theconcave portion 12 toward a direction of the normal line. The weld line61 is formed on an opposite side of the gate remain 51 across the centerC of the concave portion 12. Namely, the gate remain 51, the center C ofthe concave portion 12, and the weld line 61 are formed to be in line.

As shown in FIG. 7, the weld line 61 is formed to be perpendicularagainst the second external side surface 11 b. That is, in the package90, the first thermosetting resin is injected into a perpendiculardirection against the fourth external side surface 11 d (see arrow 91).Through this, the first thermosetting resin hits against a protrudingportion (not shown), with which the concave portion 12 is formed, of anupper die to split substantially equally into two flows, and intermingleagain with each other at a position of the weld line 61. Therefore, eachof the split two flows of the first thermosetting resin joins togetherand intermingles with each other to cause a sufficient curing reaction.As a result, a strong weld line 61 can be formed.

Here, looking at a contact portion between the weld line 61 and the leadframe 21, it can be seen that the weld line 61 is formed at a positionwhere a thickness of the first resin mold body 10 is thinner than otherpositions by a thickness of the lead frame 21. That is, the weld line 61which is low in strength is formed at a position where the first resinmold body 10 is thin and low in strength.

In this light, in the first modified example, the weld line 61 is formedat a position with which the lead frame 21 does not come in contact.That is, the weld line 61 and the gate remain 51 (injection port) areformed on an extended line of a normal line m of the concave portion 12toward a normal line direction and between the lead frames 21, 21 inplan view of the package 90. With the configuration described above,since the thickness of the first resin mold body 10 at the weld line 61can be sufficiently secured, the strong first resin mold body 10 can bemolded.

Second Modified Example

FIG. 8 is a plan view showing a second modified example of a packageaccording to the present invention.

As shown in FIG. 8, a package 92 of the second modified example isdifferent from that of the first modified example in that a weld line 62is formed diagonally in a first resin mold body 13 and that the firstresin mold body 13 has a square shape in plan view. That is, the package92 includes the first resin mold body 13, which has a square shape inplan view, having a first external side surface 14 a, a second externalside surface 14 b, a third external side surface 14 c, and a fourthexternal side surface 14 d, a first lead frame 22 a and second leadframe 22 b disposed on the second external side surface 14 b with apredetermined interval, and a third lead frame 22 c and fourth leadframe 22 d disposed on the fourth external side surface 14 d with apredetermined interval. In addition, the first resin mold body 13 isprovided with a concave portion 10 a having a circular shape in planview at the center thereof, and a gate remain 52 is formed on anextended line of a normal line m of the concave portion 10 a toward anormal line direction.

That is, in the package 92, a gate remain 52 and a weld line 62 areformed on a diagonal line of the first resin mold body 13. In theconfiguration described above, an injected first thermosetting resinalso fits against a protruding portion (not shown) of an upper die andsubstantially equally splits into two flows. Therefore, each of thesplit two flows of the first thermosetting resin joins together andintermingles with each other to cause a sufficient curing reaction. As aresult, the strong weld line 62 can be formed.

Third Modified Example

FIG. 9 is a plan view showing a third modified example of a packageaccording to the present invention.

As shown in FIG. 9, a package 94 of the third modified example isdifferent from that of the first modified example in that a normal linem of a gate remain 53 and a normal line n of a weld line 63 are not onthe same line. Namely, the package 94 includes the first resin mold body10, which has a square shape in plan view, having the first externalside surface 11 a, the second external side surface 11 b, the thirdexternal side surface 11 c, and the fourth external side surface 11 d, afirst lead frame 23 a disposed on the second external side surface 11 b,and a second lead frame 23 b disposed on the fourth external sidesurface 11 d. In addition, the first resin mold body 10 is provided withthe concave portion 12 having an ellipsoidal shape, and a gate remain 53is formed on an extended line of a normal line m of the concave portion12 toward a normal line direction. In addition, the weld line 63 isformed on an opposite side of the gate remain 53 across the center C ofthe concave portion 12.

Namely, in the package 94, the weld line 63 is formed at substantially apoint-symmetric position of the gate remain 53 with respect to thecenter of the concave portion 12. As described above, even if the firstthermosetting resin is injected obliquely against the first externalside surface 11 a See arrow 95), the first thermosetting resin flows ina direction of the normal line m of the concave portion 12, hits againsta protruding portion (not shown), which forms the concave portion 12, ofan upper die to split, and intermingles at a position of the weld line63. In this case, the normal line n of the weld line 63 and the normalline m of the gate remain 53 are formed in parallel. Therefore, each ofthe split flows of the first thermosetting resin joins together andintermingles with each other to cause a sufficient curing reaction. As aresult, a strong weld line 63 can be formed.

1. A light emitting device, comprising: a light emitting element; afirst resin mold body having an external side surface, provided with aconcave portion having a circular shape or ellipsoidal shape in planview at a center of the first resin mold body, and made of a firstthermosetting resin; a plurality of lead frames arranged on a bottomsurface of the concave portion and electrically connected to the lightemitting element; a second resin mold body made of a secondthermosetting resin filled in the concave portion, wherein the firstresin mold body comprises a gate remain disposed on the external sidesurface at a point along a line which is perpendicular to the externalside surface and which intersects the center of the first resin moldbody and therefore intersects a center of a circular cross section orellipsoidal cross section of the concave, wherein the light emittingelement is placed on the lead frame and a surface of the second resinmold body serves as a light emitting surface, wherein a bottom surfaceof the plurality of lead frames comprises a bottom surface of the lightemitting device, said device further comprising a weld line disposed ata position opposite the gate remain across a center of the concaveportion, wherein the weld line, the center of the concave portion, andthe gate remain are disposed in a linear relationship with each other.2. The light emitting device according to claim 1, wherein the gateremain is perpendicularly disposed on the external side surface of thefirst resin mold body.
 3. The light emitting device according to claim2, wherein the first resin mold body is made of a resin comprisingtriazine derivative epoxy resin.
 4. The light emitting device accordingto claim 1, wherein the first resin mold body is made of a resincomprising triazine derivative epoxy resin.
 5. The light emitting deviceaccording to claim 1, wherein the gate remain comprises a columnarshape, with a semicircular cross section.
 6. The light emitting deviceaccording to claim 1, wherein the plurality of lead frames comprise afirst lead frame and a second lead frame, wherein the firstthermosetting resin is disposed between the first lead frame and thesecond lead frame.
 7. A package, comprising: a resin mold body having anexternal side surface and provided with a concave portion having acircular shape or ellipsoidal shape in plan view at a center of theresin mold body; a plurality of lead frames arranged on a bottom surfaceof the concave portion, wherein the first resin mold body comprises agate remain disposed on the external side surface at a point along aline which is perpendicular to the external side surface and whichintersects the center of the first resin mold body and thereforeintersects a center of a circular cross section or ellipsoidal crosssection of the concave, and wherein a bottom surface of the plurality oflead frames comprises a bottom surface of the package, said packagefurther comprising a weld line disposed at a position opposite the gateremain across a center of the concave portion, wherein the weld line,the center of the concave portion, and the gate remain are disposed in alinear relationship with each other.
 8. The package according to claim7, wherein the gate remain is perpendicularly disposed on the externalside surface of the resin mold body.
 9. The package according to claim8, wherein the resin mold body is made of a resin comprising triazinederivative epoxy resin.
 10. The package according to claim 7, whereinthe resin mold body is made of a resin comprising triazine derivativeepoxy resin.
 11. The package according to claim 7, wherein the gateremain comprises a columnar shape, with a semicircular cross section.12. The package according to claim 7, wherein the plurality of leadframes comprise a first lead frame and second lead frame, wherein a partof the resin mold body is disposed between the first lead frame and thesecond lead frame.